What's New

Introducing GEM's New J-Lead Package!

GEM's 2021-8J package accommodates die up to 0.85mm X 1.65mm, yet fits on a standard SC-70 (JEDEC MO-223A-BA) PC board footprint. Eight leads give the option of both single or dual MOSFETs in traditional "SO-8 style" layout, for easy connection and low electrical and thermal impedance. The 8 leads may be configured in any combination of electrical connections and thermal (direct die pad) connections to maximize IC and PIC performance. Using the "modified J-lead" (patents pending) technology, offers a performance/area ratio that meets or exceeds any alternatives while utilizing construction that has a long history of cost effective manufacturability, and generations of reliability.