GEM's Packaging Options
Click on the package name where a link is shown for technical specifications and construction details

Proprietary and Advanced Packages

	GEMPAK	A high power package with the P.C. board footprint of a SO-8 package
	GEMTAB	Low profile, low thermal impedance, clip-lead rectifier package with high surge current capability
	GEM2021-8J	8 lead J-lead package with increased die size capacity in a SC-70 footprint More features
	GEM2021-10J	10 lead J-lead package with increased die size capacity in a SC-70 footprint
	GEM2928-8J	8 lead J-lead package with increased die size capacity in a TSOP-6 footprint More features
	GEM2928-12J	12 lead J-lead package with increased die size capacity in a TSOP-6 footprint More features
	GEM2928-14J	14 lead J-lead package with increased die size capacity in a TSOP-6 footprint
	GEM4040-24J release: Q4 '07	24 lead 4 mm x 4 mm space-saving cost-effective quad J-lead package
	GEM4040-28J release: Q4 '07	28 lead 4 mm x 4 mm space-saving cost-effective quad J-lead package
	Power BGA family	Direct connection to the die for high performace in a small footprint More features
	QFN-style packages	QFN-style capability for multi-chip packages and ICs More details

Industry-Standard IC Packages

SO-8
SO-14
SSOP-20
TSSOP-8

• TO-3P
• TO-220
• TO-220CFM
• TO-220FM
• TO-252, TO-251