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GEM's
Packaging Options
Click on
the package name where a link is shown for technical specifications and
construction details
Proprietary and Advanced Packages
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GEMPAK |
A high
power package with the P.C. board footprint of a SO-8 package
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GEMTAB |
Low
profile, low thermal impedance, clip-lead rectifier package with high
surge current capability
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GEM2021-8J |
8 lead
J-lead package with increased die size capacity in a SC-70 footprint
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GEM2021-10J |
10 lead
J-lead package with increased die size capacity in a SC-70 footprint
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GEM2928-8J |
8 lead
J-lead package with increased die size capacity in a TSOP-6 footprint
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GEM2928-12J |
12 lead
J-lead package with increased die size capacity in a TSOP-6 footprint
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GEM2928-14J |
14 lead
J-lead package with increased die size capacity in a TSOP-6 footprint
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GEM4040-24J
release: Q4 '07 |
24 lead
4 mm x 4 mm space-saving cost-effective quad J-lead package
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GEM4040-28J
release: Q4 '07 |
28 lead
4 mm x 4 mm space-saving cost-effective quad J-lead package
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QFN-style packages |
QFN-style
capability for multi-chip packages and ICs
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Industry-Standard IC Packages
• SO-8
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SO-14
•
SSOP-20
•
TSSOP-8
Industry-Standard Transistor Packages
• TO-3P
• TO-220
• TO-220CFM
• TO-220FM
• TO-252,
TO-251
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