Power BGA Package

The Power BGA is a revolutionary new package for power semiconductors. It eliminates not just one, but many of the downsides associated with traditional packages.

The Power BGA package:

• Eliminates bond wires and the associated resistance and inductance
• Increases footprint utilization by eliminating leads
• Allows cooling from the top of the package when mounting on a P.C. board

Typical Package Inductance Comparison, Power BGA Vs. SO-8

Package	Lsource (pH)	Ldrain (pH)	Lgate (pH)
SO-8	690	318	1800
5.0 x 5.5 mm BGA	6	30	40

Typical Package Thermal Performance Comparison

Standard Package	Package Rthja	Equivalent BGA	BGA Rthja *
SO-8	63 °C/W	5.0 x 5.5 mm	44 °C/W
TSOP-6	78 °C/W	2.5 x 4.0 mm	60 °C/W
SC-70	260 °C/W	2.0 x 2.5 mm	64 °C/W
SC-75	500 °C/W	2.0 x 2.0 mm	67 °C/W

* further improvement possible by applying heatsink to the package

Power BGA Construction

The BGA package is constructed by placing an array of small balls on the top of the die for source and gate connections, for example. The die is then attached to a leadframe that also has dimples on raised sections that align with the array of balls on the die. This leadframe provides connection to the back of the die, and also provides protection for the die. Standard leadframes range from 1.5 mm x 1.5 mm to 5.0 x 5.5 mm and include a common drain configuration.

The completed package is tested and shipped in tape and reel. The package is mounted on a P.C. board using conventional BGA techniques and creates a very space-efficient footprint.