| |
GEM
Power BGA Packages
|
Wafer
Specifications
|
| Wafer
Diameter |
8
inch (200 mm) maximum |
| Wafer
Thickness |
8
mil (0.2 mm) |
|
Package
Specifications
|
| Leadframe
Material |
Copper |
| Approximate
Maximum Die Sizes |
1.3
x 0.9 mm (1.5
x 1.5 mm leadframe)
1.8 x 1.1 mm (2.0 x 2.0 mm leadframe)
1.8
x 2.4 mm (2.5 x 4.0 mm leadframe)
2.3 x 2.3 mm (3.5 x 4.0 mm
leadframe)
3.0 x 4.2 mm (5.0
x 5.5 mm leadframe) |
| Finished
Package Height |
0.9
mm (5.0 x 5.5 mm),
0.8 mm (all others) |
| Ball
Grid Array Pitch |
0.5 mm (1.5 mm x 1.5
mm package)
0.80 x 0.85 mm (5.0 x 5.5 mm
package) 0.65 mm (all others) |
|
Construction
Details
|
| Die
Attach |
Soft
Solder |
| Ball
Material |
Lead
free Solder over Copper |
|
Mark,
Test, and Pack
|
| Test
Capability |
100%
DC Electrical, discrete tester |
| Tape
and Reel |
7"
reel, 1.5 x 1.5 mm, 2.0 x 2.0 mm,
2.5 x 4.0 mm.
13"
reel , 4.0 x 3.5 mm,
5.0 x 5.5 mm |
Note: This document is intended as a guideline only. To discuss options for your
die, please contact GEM. |
|
