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GEM
TO-220 Fully Molded
|
Wafer
Specifications
|
| Wafer
Diameter |
8
inch (200 mm) maximum |
| Wafer
Thickness |
6
mil ( 0.16 mm) minimum
14 mil (0.35 mm) maximum |
|
Leadframe
Specifications
|
| Leadframe
Material |
Copper |
| Leadframe
Options |
Single
pad, 3 leads |
| Die
Pad Size* |
260
mils x 205 mils (6.6 mm x 5.2 mm) |
| Leadframe
Finish |
Selective
Nickel plating |
| Lead
Finish |
100% Tin plating |
|
Construction
Details
|
| Standard
Molding Compound |
Epoxy Compound |
| Die
Attach |
Soft
Solder |
| Bond
Wire Material |
Aluminum |
| Bond
Wire Diameter |
1.0,
5, 8, 10, 12, 15 or 20 mils standard |
| Leadform
Options |
No leadforms performed as standard |
|
Mark,
Test, and Pack
|
| Marking |
Laser,
3 lines maximum |
| Test
Capability |
100%
DC Electrical, IC or discrete tester |
| Packaging |
Tubes or bags |
.
Note: This document is intended as a guideline only. To discuss options for your
die, please contact GEM.
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