QFN Package Capability

GEM Services has developed a proprietary DFN/QFN process that is optimized for Power ICs and multi-chip modules as part of its packaging portfolio. In addition, GEM has signed a broad, multi-year, patent license agreement with Amkor Technology, Inc. (Nasdaq: AMKR) that allows GEM to practice under Amkor's portfolio of MicroLeadFrame® patents. This agreement provides GEM the flexibility and the option to access Amkor's MLF® patents and add GEM's expertise in Power Management to help satisfy our customers' growing demands for new packaging technology.

In line with GEM's value added philosophy, we are concentrating on developing and testing lower pin-count QFN packages, with improved performance such as lower thermal resistance, high current ratings or multi-chip capbility. GEM Services has significant experience in the assembly and testing of high power multi-chip modules containing controller ICs, MOSFETs, IGBTs and diodes, and we are applying this expertise to QFN-style packages.