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GEM
Dpak Packages (TO-251,TO-252)
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Wafer
Specifications
|
| Wafer
Diameter |
6
inch (150 mm) maximum |
| Wafer
Thickness |
6
mil ( 0.16 mm) minimum
14 mil (0.35 mm) maximum |
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Leadframe
Specifications
|
| Leadframe
Material |
Copper |
| Leadframe
Options |
Single
pad, 2, 3 or 5 leads |
| Die
Pad Size* |
175
mils x 120 mils (4.4 mm x 3.0 mm) |
| Leadframe
Finish |
Selective
Silver or Nickel plating |
| Lead
Finish |
Solder
plated or pure Tin (lead-free) |
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Construction
Details
|
| Standard
Molding Compound |
Sumitomo 6600CR |
| Die
Attach |
Soft
Solder or epoxy |
| Bond
Wire Material |
Gold
or Aluminum |
| Bond
Wire Diameter |
1.0,
1.3. 2.0 or 2.75 mils standard Au
5, 6, 8, 10, 12 or 15 mils standard Al |
| Leadform
Options |
Standard,
reverse, and through hole |
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Mark,
Test, and Pack
|
| Marking |
Laser,
3 lines maximum |
| Test
Capability |
100%
DC Electrical, IC or discrete tester |
| Tape
and Reel |
13
inch reel, per EIA |
* Pad size shown is the standard
production leadframe. A variety of leadframe options are available.
Note: This document is intended as a guideline only. To discuss options for your
die, please contact GEM.
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