| |
GEM
2928-12J, -14J Package
|
Wafer
Specifications
|
| Wafer
Diameter |
8
inch (200 mm) maximum |
| Wafer
Thickness |
6
mil ( 0.16 mm) minimum
9 mil (0.23 mm) maximum |
|
Leadframe
Specifications
|
| Leadframe
Material |
Copper |
| Leadframe
Options |
Single
pad, dual pad, H bridge |
| Die
Pad Size* |
104
mils x 50 mils (2.6 mm x 1.2 mm) |
| Leadframe
Finish |
Selective
Silver plating |
| Lead
Finish |
Solder
plated or pure Tin (lead-free) |
|
Construction
Details
|
| Standard
Molding Compound |
Shin-Etsu KMC-184-7 |
| Die
Attach |
Epoxy,
conductive or non-conductive |
| Bond
Wire Material |
Gold |
| Bond
Wire Diameter |
1.0,
1.3, or 2.0 mils standard |
|
Mark,
Test, and Pack
|
| Marking |
Laser,
3 lines maximum |
| Test
Capability |
100%
DC Electrical, IC or discrete tester |
| Tape
and Reel |
7
inch reel, per EIA |
* Pad size
shown is the largest of leadframes in production. A variety of
leadframe options are available.
Note: This document is intended as a guideline only. To discuss options for your
die, please contact GEM. |
|
